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TSMC Fab 21 – Phoenix, Arizona

Location: Phoenix, Arizona
Project Type: Industrial – Semiconductor Manufacturing
Scope: Structural Steel Detailing, Connection Detailing, Equipment & Utility Support Steel, Platforms, and Miscellaneous Steel

Project Overview

The TSMC Fab 21 project involved comprehensive steel detailing for a highly complex semiconductor manufacturing facility in Phoenix, Arizona. The project incorporates extensive structural framing, equipment support systems, utility steel, platforms, and miscellaneous steel, requiring a high level of precision and coordination across multiple building disciplines.

Structures Online (SOL) provided detailed 3D steel models and fabrication-ready shop drawings for assigned areas of the facility. Working within a multi-GC and multi-fabricator environment, SOL coordinated structural steel with equipment, utilities, MEP systems, architectural elements, and existing conditions to support constructability, fabrication efficiency, and field installation.

Scope of Work

Structural Steel Framing & Connections: SOL detailed primary and secondary structural steel, including beams, columns, girders, and bracing systems. Beam-to-column, beam-to-beam, splice, brace, and base-plate connections were developed with accurate plate configurations, bolt layouts, weld information, and stiffening components to support fabrication and erection.

Braced Frames & Gusset Connections: Brace-to-beam and brace-to-column connections required detailed coordination of brace geometry, gusset plates, bolt patterns, stiffeners, and surrounding framing. Particular attention was given to connection clearances, fit-up, and access requirements for fabrication and field erection.

Column Splices & Base Plate Assemblies: Column splice and base-plate assemblies were detailed with coordinated splice plates, stiffeners, bolt arrangements, base plates, and anchor-rod interfaces. Member alignment, elevations, and steel-to-concrete interfaces were carefully modeled to maintain constructability and dimensional accuracy.

Equipment & Utility Support Steel: A significant portion of the project involved support steel for equipment, utilities, MEP systems, and associated services. SOL detailed support frames, brackets, racks, platforms, and miscellaneous steel while coordinating equipment clearances, elevations, connection access, and adjacent building systems.

Platforms, Stairs & Access Systems: Platforms, stairs, ladders, handrails, and other access structures were detailed and integrated with the surrounding structural framing. These systems required close coordination with equipment locations, architectural requirements, and maintenance access provisions.

BIM & Multidiscipline Coordination: The project required extensive 3D coordination between structural steel and architectural, mechanical, electrical, process equipment, and utility systems. Model reviews and clash detection were used to identify potential conflicts involving steel members, connections, piping, ductwork, cable trays, equipment, and support systems before fabrication.

Key Deliverables

• Detailed 3D structural and miscellaneous steel models

• General arrangement, erection, assembly, and single-part drawings

• Detailed beam, brace, splice, base-plate, bolt, weld, and connection information

• Equipment and utility support steel detailing

• Platforms, stairs, ladders, handrails, and access structures

• BIM coordination and clash resolution

• Material, piece-mark, and CNC/NC information where required

• Revision and field-condition coordination supporting fabrication and erection

Project Outcome

Through accurate 3D modeling, detailed connection development, multidisciplinary coordination, and fabrication-focused documentation, Structures Online supported the successful detailing and fabrication of its assigned steel scopes within the TSMC Fab 21 project.

The project demonstrates SOL’s capabilities in high-precision industrial steel detailing, complex structural connections, equipment and utility support systems, and multidisciplinary BIM coordinationwithin a large-scale, multi-GC and multi-fabricator semiconductor manufacturing environment.

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